Comminucation board
|
Product type
|
Comminucation board
|
|
Layers
|
4L
|
|
Surface
|
OSP
|
|
Line width/spacing
|
150/150μm
|
|
Min BGA Pitch
|
N/A
|
|
Overal board thickness
|
1.6mm
|
|
Special Characteristics
|
IPC-Class III
|
|
STACK UP
|
COPPER FOIL 1/2OZ
|
|
2116
|
|
51mil 1oz/1oz
|
|
2116
|
|
COPPER FOIL 1/2OZ
|
