| Item | Process capability |
| Layer | 1-34layer(Rigid) |
| Max production size | 900mm X620mm |
| Tolerance of outline | ±0.1mm (±4 mil) |
| Board thickness | 0.20mm-6.0mm |
| Tolerance of thickness(≥0.8mm) | ±10% |
| Tolerance of thickness(<0.8mm) | N/A |
| Min sapcing/tracking | 3mil/3mil |
| Outer layer copper thickness | 35-175um(1-5OZ) |
| Inner layer copper thickness | 12-105um(1/3H-3OZ) |
| Min BGA | 8mil |
| Finished hole size (mechanical drilling) | 0.20mm-6.50mm(0.1mm by laser drilling) |
| Hole position tolerance(mechanical drilling) | ±0.05mm |
| Board thickness:Hole size | 10:1 |
| Min solder mask bridge |
0.075mm Green soldermask; 0.1mm Others soldermask |
| Plugged hole diameter | 0.20mm-0.50mm(green soldermask) |
| Pmpedance control tolerance | <50Ω±5Ω,≥50Ω±10% |
| Surface finishing |
ENIG、HASL/HASL LF、OSP、Goldfinger (thickness 1-30μ") Gold +OSP etc; |